[TYPES/announce] Call for Papers: WODA 2015

Yudi Zheng yudi.zheng at usi.ch
Tue Jun 30 09:14:35 EDT 2015


       The 13th International Workshop on Dynamic Analysis (WODA'15)
                  Co-located with SPLASH/OOPSLA 2015
                       Sponsored by ACM SIGPLAN
                    Pittsburgh, PA, October 26, 2015

            http://2015.splashcon.org/track/WODA-2015-papers

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IMPORTANT DATES

Paper submission:     Aug. 07, 2015
Author notification:  Sep. 07, 2015
Conference:           Oct. 26, 2015

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SUBMISSION SITE:

https://easychair.org/conferences/?conf=woda15

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TOPICS OF INTEREST

WODA is a forum for researchers and practitioners interested in the intersection 
of compilers, programming languages, architecture, systems, high-performance 
computing, software engineering, performance engineering, machine learning, and 
data mining for addressing software and system performance. The workshop focuses 
on developing and studying analytic technologies (e.g., program analysis, 
statistical analysis, machine learning, data mining, visualization) applied on 
various software or system artifacts (e.g., production systems, tests, program 
traces, system logs) to address issues in software and system reliability, 
dependability, performance, and scalability.

WODA welcomes submissions that propose dynamic analysis techniques for solving 
all kinds of problems in software and systems; typical areas of interest that 
WODA covers are:

- Development of dynamic analysis tools and frameworks
- Efficient instrumentation techniques
- Novel applications of dynamic analysis
- Program security and penetration testing
- Fault detection, debugging, and tolerance
- Performance analysis and optimization techniques
- Remote analysis and measurement of software systems
- Runtime monitoring
- Software and systems testing
- Statistical reasoning techniques
- Visualization and classification of program behavior
- Relating user feedback to execution dynamics
- Dynamic analysis for efficient memory management
- Dynamic analysis on embedded and mobile systems

Submissions addressing an emerging problem are especially welcome. The workshop 
will be structured to encourage discussion and develop research collaborations.

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SUBMISSION GUIDELINES

Submissions must be in ACM SIGPLAN proceedings format, 10-point type, and may 
not exceed 6 pages. Submissions must be in PDF, printable on US Letter.

Submissions to WODA should be in one of the following two categories:

- A four to six page position/idea paper describing an issue in the field, and 
  arguing for a specific stance or approach to that issue
- A two-page extended abstract describing an ongoing project

All submissions will be peer-reviewed by at least three members of the program 
committee. During the workshop, extended abstracts will receive a shorter 
presentation and discussion period.

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ORGANIZERS

Organizing Committee:

Workshop co-chairs: 
Harry Xu, University of California, Irvine, USA
Walter Binder, University of Lugano, Switzerland

Program Committee:
Shigeru Chiba, The University of Tokyo, Japan
Brian Demsky, University of California, Irvine, USA
Julian Dolby, IBM Thomas J. Watson Research Center, USA 
Irene Finocchi, University of Rome "La Sapienza", Italy 
Thomas Gross, ETH Zurich, Switzerland
Rajiv Gupta, University of California Riverside, USA
Matthias Hauswirth, University of Lugano, Switzerland
Yu David Liu, SUNY Binghamton, USA
Yi Lu, Oracle Labs, Australia
Hans peter Mössenböck, Johannes Kepler University, Austria 
Atanas Rountev, Ohio State University, USA
Petr Tuma, Charles University, Czech Republic
Jianjun Zhao, Shanghai Jiao Tong University, China
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